New Delhi, Aug 12: In a landmark move to strengthen India’s semiconductor ecosystem, the Union Cabinet chaired by Prime Minister Narendra Modi approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM), with a combined investment of Rs4,600 crore, informed Union Minister Ashwini Vaishnaw on Tuesday.

The projects will be established in Odisha, Punjab, and Andhra Pradesh, and are expected to generate employment for 2,034 skilled professionals.

Among the most notable developments is the establishment of India’s first commercial compound semiconductor fab by SiCSem Private Limited in collaboration with Clas-SiC Wafer Fab Ltd., UK. Located in Info Valley, Bhubaneswar, Odisha, this facility will manufacture Silicon Carbide (SiC) devices with applications in defence, electric vehicles, solar inverters, and more. It will have an annual capacity of 60,000 wafers and 96 million packaged units.

Also in Bhubaneswar, 3D Glass Solutions Inc. will set up a cutting-edge packaging and embedded glass substrate unit. This vertically integrated facility will introduce advanced technologies such as glass interposers, silicon bridges, and 3D Heterogeneous Integration (3DHI) modules. With a planned capacity of 69,600 glass panels and 50 million assembled units annually, the products will serve sectors like AI, photonics, RF, and automotive.

In Andhra Pradesh, ASIP Technologies will collaborate with South Korea’s APACT Co. Ltd. to establish a semiconductor packaging unit with a capacity of 96 million units per year. These will be used in mobile phones, set-top boxes, and automotive electronics.

Meanwhile, Continental Device India Ltd. (CDIL) will expand its facility in Mohali, Punjab, to manufacture high-power discrete semiconductor devices including MOSFETs, IGBTs, and Schottky diodes. The expansion will produce over 158 million units annually, supporting EVs, renewable energy, and industrial applications.

With these approvals, the total number of projects under ISM rises to ten, spanning six states and representing Rs 1.60 lakh crore in cumulative investment. These initiatives complement India’s growing chip design capabilities, supported by government infrastructure across 278 academic institutions and 72 startups.

Over 60,000 students have already benefited from talent development programs, signaling a robust future for India’s semiconductor ambitions, Minister Vaishnaw said.
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